📋 Survey Progress

Completed: 0 / 14 sections

🎉 All Complete

1
Project Overview
Basic information
2
Wireless Communication
Bluetooth, WiFi, etc.
3
Interaction Methods
Buttons, touch, etc.
4
MCU & Low Power
Processor types
5
Storage Configuration
Memory & storage
6
Sensor Types
Various sensors
7
Appearance Design
Form & materials
8
AI Functional Requirements
AI models & interaction
9
Interfaces & Features
Expansion ports
10
Production & Supply
Manufacturing & certs
11
Budget & Timeline
Cost & schedule
12
After-sales Support
Technical support
13
Company Capabilities
Team & resources
14
Contact Information
Contact details

AI Consumer Electronics Hardware Requirements Comprehensive Survey

Welcome to the future of AI-powered consumer electronics. This comprehensive survey will help us understand your specific hardware requirements for AI consumer electronic products.

Your selections will enable our engineering team to design and manufacture a customized solution that perfectly matches your product vision and technical specifications. From project overview to after-sales support, we provide comprehensive professional services.

🎯 Precision Engineering

🚀 Cutting-edge Technology

⚡ Performance Optimization

🤝 Full-Service Support

Auto-save feature enabled – Your progress will be automatically saved, so you won’t lose data even if you refresh the page or accidentally close it.

1. Project Overview

1.1 Product / Project Name * : 1.2 Project Goals: Enhanced User Experience Improve Efficiency – Automation Improve Health Monitoring Other1.3 Product Type: Full-Custom New Product（From scratch, fully customized new product） Upgrade My Existing Product（Based on existing products for optimization and upgrade） Customize ODM Platform（Based on GMIC’s existing modules or solutions for customization）1.4 Target Delivery Time:

Please select a future date (within one year)

1.5 Project Scale: Small Batch(1-2000pcs) Medium Batch(2000-50000pcs) Large Batch(50000pcs+)1.6 Target User Groups: Individual Consumers (for personal use) Business or Institutional Users (for team or enterprise use) Medical Staff (doctors, nurses, care workers) Technical Professionals (engineers, developers, R&D) Others (please specify):1.7 Expected User Age Groups: Children Teenagers Adults Elderly1.8 Usage Scenarios: Indoor Environments

Homes, offices, clinics, classrooms, etc.

Outdoor Environments

Parks, construction sites, open fields, etc.

In-Vehicle or Mobile Use

Automobiles, ambulances, delivery vehicles, etc.

High-Temperature Environments

Above 45°C (e.g., factories, kitchens, outdoor summer heat)

High-Humidity or Water-Prone Areas

Bathrooms, saunas, industrial kitchens, tropical zones

Dusty or Particulate Environments

Mines, workshops, construction zones

Shock-Prone or High-Vibration Areas

Transport containers, warehouse sorting belts, field gear

Hazardous or Regulated Zones

Explosive risk, chemical zones, hospital operating rooms, etc.

Others (Please specify):1.9 Usage Frequency: Daily Use

Used multiple times per day or every day

Weekly Use

Used a few times per week

Occasional Use

Used irregularly, such as a few times per month

On-Demand / Event-Triggered

Used only in specific scenarios or as needed

One-Time Use Only

Single-use product or usage expected only once

2. Wireless Communication

2.1 Required wireless technologies: Bluetooth Classic (BR/EDR) Bluetooth Low Energy (BLE) Bluetooth LE Audio Support Dual-mode Bluetooth (Classic + BLE) Wi-Fi 2.4GHz (802.11 b/g/n) Wi-Fi 5GHz (802.11 ac) Wi-Fi Dual Band (2.4G+5G) Wi-Fi 6 (802.11 ax) Wi-Fi 6E (6GHz) Ultra-Wideband UWB Near Field Communication NFC ZigBee Thread (802.15.4) LoRa Long Range Communication Sigfox Ultra-Narrowband Sub-1GHz Proprietary RF ANT/ANT+ (Sports Sensor Protocol) Cellular NB-IoT (Narrowband IoT) Cellular 4G LTE Cellular 5G 2G/3G Cellular Fallback Satellite Communication (SOS Emergency) Other 2.2 Bluetooth Configuration/Protocol Requirements: A2DP Stereo Audio AVRCP Media Control HFP/HSP Hands-free Calling BLE Data Transfer (GATT) BLE Audio (LC3) LE Audio Broadcast BLE Mesh Network Serial Port Profile SPP HID Peripheral (Human Interface Device) Multi-device Connection (Multipoint) Other2.3 Wi-Fi Function Mode: Wi-Fi Client Mode (Station) Wi-Fi Hotspot Mode (AP) Wi-Fi Direct Other2.4 NFC Features: NFC Reader Mode NFC Card Emulation (Payment) NFC Peer-to-Peer (P2P)2.5 Cellular Network Features: Cellular Data Communication Cellular Voice Call Function SMS Support Physical SIM Card Slot eSIM Embedded Card Other

3. Interaction Methods

3.1 Physical Interaction Options: Physical Buttons (Small Buttons) Large Buttons (Large Area Buttons) Touch Buttons (Capacitive Touch) Touch Slider Scroll Wheel (Rotary Dial) Knob (Volume Control Knob) Key Combination Support 5-way Navigation/Joystick Touchpad (Screenless Touch Area) Touchscreen Interaction Motion Gesture Control (Movement Gestures) Voice Command Control Squeeze Pressure Control Other3.2 Button Operation Modes: Single Click Double Click Triple Click Long Press Other

4. MCU & Low Power

4.1 Processor Type Preference: ARM Cortex-M Series MCU ARM Cortex-A Series SoC (Linux) RISC-V MCU Dedicated Voice DSP/AI Chip No Particular Preference Other4.2 Low Power Feature Requirements: Deep Sleep Mode Support Ultra Low Power Idle Mode Multi-level Power Modes (Run/Standby/Sleep) RAM Retention during Sleep (Data Retention) Dynamic Frequency/Voltage Scaling (DVFS) Built-in RTC Timekeeping Independent Always-on Auxiliary Core Other4.3 MCU Wake-up Sources: RTC Timer Wake-up Timer Interrupt Wake-up External GPIO Interrupt Wake-up Motion Sensor Wake-up (Acceleration) Sound Triggered Wake-up (Voice) Touch Wake-up Other

5. Storage Configuration

5.1 MCU Internal Memory Configuration: Flash Capacity: ≤128KB ≤256KB ~512KB ~1MB ~2MB ~4MB >4MB OtherRAM Capacity: ≤64KB ≤128KB ≤256KB ~512KB ~1MB >1MB Other5.2 MicroSD Card Expansion: No MicroSD Support Support, ≤16GB Support, ≤32GB Support, ≤64GB Support, ≤128GB Support, >128GB Other5.3 Onboard eMMC Flash: No Onboard eMMC Required 4GB eMMC 8GB eMMC 16GB eMMC 32GB eMMC 64GB eMMC 128GB eMMC Other5.4 External Flash Capacity (SPI/QSPI): No External Flash Required 8MB SPI Flash 16MB SPI Flash 32MB SPI Flash 64MB SPI Flash 128MB SPI Flash 256MB SPI Flash Other5.5 External Expansion RAM: No External RAM Required 4MB PSRAM 8MB PSRAM 16MB PSRAM ≥32MB PSRAM Other5.6 Other External Storage Support: SPI NAND Flash FRAM Ferroelectric Storage EEPROM Storage Other

6. Sensor Types

6.1 Do you need a camera? No Yes, specify features below

Front-facing Camera Rear-facing Camera 4K Video Capture Depth-Sensing Camera AI Vision / Object Recognition Other

6.2 Motion Sensors: 3-Axis Accelerometer 3-Axis Gyroscope Magnetometer (Digital Compass) 6-Axis IMU (Accelerometer + Gyroscope) 9-Axis IMU (Accelerometer + Gyroscope + Magnetometer) Hall Sensor (Magnetic Detection) Other (Motion)6.3 Biosensors: Heart Rate Sensor (PPG) Pulse Sensor Blood Oxygen SpO2 Sensor Body Temperature Sensor (Contact) ECG Sensor (Electrocardiogram) Blood Pressure Monitoring Sensor GSR Sensor (Galvanic Skin Response) Bioimpedance Sensor (Body Fat) EMG Sensor (Electromyography) EEG Sensor (Electroencephalogram) Fingerprint Recognition Sensor Other (Biosensor)6.4 Environmental Sensors: Ambient Light Sensor Ambient Temperature Sensor Ambient Humidity Sensor Barometric Pressure Sensor (Altimeter) UV Sensor (Ultraviolet) Proximity Sensor Gesture Recognition Sensor (Infrared) mmWave Radar Sensor Color Sensor CO2 Sensor (Carbon Dioxide) VOC Sensor (Air Quality) Dust/PM2.5 Sensor Other (Environmental)6.5 Positioning Module: GNSS Positioning Module (GPS, etc.)6.6 Haptic Feedback: Vibration Motor/Haptic Feedback Other6.7 GNSS System Support: GPS BeiDou GLONASS Galileo NavIC (India Regional) Other

7. Appearance Design

7.1 Product Form: Handheld Desktop Wearable (specify below)

Clip-on Necklace Wrist-mounted Pin Badge Magnetic Mount Other

Stationary Other (Product Form)7.2 Size Limitations: 7.3 Color Preferences: Black White Gray Other7.4 Material Preferences: Plastic Metal Glass Rubber Other7.5 Screen Type: OLED LCD E-Ink No Screen7.6 Screen Size: 7.7 Touch Type: Single Touch Multi-Touch Capacitive Resistive Other7.8 Display Requirements: High Resolution Adjustable Brightness Anti-Glare Other

8. AI Functional Requirements & Software Solutions

8.1 AI Model Requirements: ChatGPT Claude Gemini Custom Trained Model Other8.2 AI Interaction Methods: Voice Interaction Image Recognition Natural Language Processing Gesture Recognition Other8.3 AI Inference Mode: Cloud Local Hybrid 8.4 Language Support: English Chinese Multi-language Other8.5 AI Use Cases: Smart Assistant Automation Control Data Analysis Personalized Recommendations Other8.6 Machine Learning Update Frequency: Weekly Monthly On-Demand 8.7 Suite A – API / SDK Integration (multi‑select) OAuth 2.0 / PKCE Bridge JWT / Token Lifecycle RESTful API Gateway WebSocket Push Channel gRPC Micro‑service Wrapper iOS Swift Package Android AAR / Kotlin Module React‑Native Bridge Flutter Plugin Template OpenAPI 3.1 Doc Generator Postman Collection Export CORS Strategy Preset API Log Trace Prometheus Metrics Rate‑Limit & Quota Auto Reconnect SDK Incremental OTA Params Bi‑directional File Upload Edge‑AI Result Callback CDN Static Hook Multi‑version Rollback Offline Cache Layer HMAC / mTLS Encryption Custom S3 / GCS Bridge Data Masking / Mapping i18n SDK Support Code‑Snippet Generator SLA Webhook & Alert Automated Integration Test SDK License Template Retry Queue / Backoff Azure / AWS IoT Core MQTT Bridge (QoS 0‑2) FCM / APNs Push Deep‑Link & App Clip Multi‑tenant Key Isolation SAML / OIDC Identity Zapier / IFTTT Hook Batch Import / Export Custom Objects / Fields Markdown Rendering SLA Dashboard n‑Package Modular Release Usage‑based Billing API Zero‑Config Demo App Changelog Push SDK Hotfix Channel Dark‑mode Placeholder Low‑Code API Config One‑line Install Script Other (Suite A)8.8 Suite B – Full‑Stack Software Flow (multi‑select) Product Workshop CI / CD Pipeline Micro‑service Domain Blueprint Kubernetes Helm Charts PostgreSQL Multi‑tenant Event‑Driven Kafka Bus Serverless Orchestration Time‑series DB Blue / Green Release Feature Toggle Chatbase + RAG Dialogue FSM LangChain / LlamaIndex Prompt‑Version Repo Speech Transcription Semantic Split & Tags LLM Post‑processing Speaker Diarization PDF / Doc Parsing ElasticSearch Cluster AES‑256 Encryption RBAC + ABAC HIPAA / GDPR Pack SSO + MFA Audit Log & Hash Chain APM Monitoring TraceID Propagation BI Dashboard Real‑time Analytics Stripe Billing PCI‑DSS Bridge SDK / CLI Release Swagger + GraphQL Repro Debug Record Chaos Testing End‑user Onboarding Email Triggers A/B & Mult‑arm Bandit Low‑Code Schema Builder OTA Firmware Backend Graylog Central Logs Edge POP Acceleration Power‑saving Strategy White‑label Mobile Shell UAT Sandbox Generator Reverse Proxy + WAF Benchmark Scripts LLM Filter + DLP 24×7 Bot Ticket Quarterly Business Review Pack Other (Suite B)

9. Other Interfaces & Features

9.1 Speaker Power Output: ≤1W ≤3W ≤5W ≤10W Other9.2 Battery Capacity / Estimated Runtime: ≤4 hours 4–8 hours 8–16 hours ≥24 hours Custom9.3 Expansion Interfaces & Power Connectors: USB Type-C Interface Micro-USB Interface Pogo Pin Contacts Wireless Charging Support Debug Interface/Download Port (UART/SWD) 3.5mm Audio Jack Infrared Emitter Module Other9.4 Display & Indication Requirements: No Display/Indication (Voice Feedback Only) Single Color LED Indicator Multi-color RGB LED Indicator Multiple LED Indicators Seven-segment/Digital Display Monochrome Small Screen (LCD/OLED) Color Display Screen (LCD/OLED) E-ink Display Touch Display Screen Small Size Screen (<1.5 inches) Medium Size Screen (1.5-3 inches) Large Size Screen (>3 inches) Other9.5 Microphone Configuration: Single Microphone Dual Microphone Array Triple Microphone Array Quad Microphone Array Bone Conduction Microphone Other

10. Production & Supply

10.1 Production Requirements: Prototype & Small-Batch Production Scalable Production up to 20,000 pcs/month High-Volume Readiness for Up to 200,000 pcs/month10.2 Material Source: Domestic International Supplier Recommendation10.3 Production Quality Standards: ISO9001 Six Sigma RoHS Compliance Other10.4 Required Certifications and Compliance Standards: 10.4.1 Regulatory Certifications: FCC (Federal Communications Commission) CE Marking (Conformité Européenne) IC (Industry Canada) CCC (China Compulsory Certification) KCC (Korea Communications Commission) MIC (Ministry of Internal Affairs and Communications – Japan) 10.4.2 Environmental and Safety Standards: RoHS (Restriction of Hazardous Substances) REACH (Registration, Evaluation & Authorization of CHemicals) WEEE (Waste Electrical and Electronic Equipment) UL (Underwriters Laboratories) IEC 62368-1 (Audio/Video Safety) 10.4.3 Data Privacy and Security Certifications: HIPAA (Health Insurance Portability and Accountability Act) ISO 27001 (Information Security Management) AICPA SOC 2 (Service Organization Control 2) GDPR Compliance (General Data Protection Regulation) CCPA Compliance (California Consumer Privacy Act) FERPA (Family Educational Rights and Privacy Act) FIPS 140-2 (Federal Information Processing Standard) 10.4.4 Industry-Specific Certifications: FDA (Food and Drug Administration) ISO 13485 (Medical Devices) IATF 16949 (Automotive) DO-178C (Aviation Software) IEC 61508 (Functional Safety) 10.4.5 International Quality Standards: ISO 9001 (Quality Management) ISO 14001 (Environmental Management) ISO 45001 (Occupational Health and Safety) TS 16949 (Automotive Quality) 10.4.6 Wireless and Connectivity Certifications: Wi-Fi Alliance Certification Bluetooth SIG Qualification Zigbee Certification Thread Certification Matter Certification10.5 Packaging Requirements:10.6 Logistics Requirements: Air Transport Sea Transport Land Transport Other

11. Budget & Timeline

11.1 Budget Range: $1K – $5K $5K – $10K $10K – $20K $20K – $50K $50K – $100K $100K+11.2 Timeline Expectations: Under 3 months 3-6 months 6-12 months Over 12 months11.3 Project Milestone Setting: Requirement Definition Prototype Development Small Batch Production High Volume Production Market Launch Other11.4 Project Priority: Time Priority Quality Priority Cost Priority

12. After-sales Support

12.1 Fault Diagnosis and Repair: Remote Diagnosis On-site Repair Preventive Maintenance Replacement Parts Supply Other12.2 Customer Training: Operation Training Maintenance Training Troubleshooting Training Other12.3 Technical Documentation: User Manual API Documentation Troubleshooting Guide Other12.4 After-sales Service Level: 24/7 Support Business Hours Support Response Time Based Other

13. Company Capabilities

13.1 Customer Existing Capabilities: R&D Team Manufacturing Capability Testing & Validation Certification Support Global Support Other13.2 Expected Responsibilities: GMIC Responsible Customer Responsible Joint Cooperation Other13.3 Project Participation Stages: Requirement Definition Design & Development Production Testing Marketing & Promotion Other

14. Contact Information

Your Email Address * :

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GMIC.AI

AI Hardware Requirements Survey

📋 Survey Progress

AI Consumer Electronics Hardware Requirements Comprehensive Survey

1. Project Overview

2. Wireless Communication

3. Interaction Methods

4. MCU & Low Power

5. Storage Configuration

6. Sensor Types

7. Appearance Design

8. AI Functional Requirements & Software Solutions

9. Other Interfaces & Features

10. Production & Supply

11. Budget & Timeline

12. After-sales Support

13. Company Capabilities

14. Contact Information

Ready to Submit Your Survey?

Quick Tools

AI Hardware Requirements Survey

📋 Survey Progress

AI Consumer Electronics Hardware Requirements Comprehensive Survey

1. Project Overview

2. Wireless Communication

3. Interaction Methods

4. MCU & Low Power

5. Storage Configuration

6. Sensor Types

7. Appearance Design

8. AI Functional Requirements & Software Solutions

9. Other Interfaces & Features

10. Production & Supply

11. Budget & Timeline

12. After-sales Support

13. Company Capabilities

14. Contact Information

Ready to Submit Your Survey?

Quick Tools

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